Chi Hwan Lee is Assistant Professor of Biomedical Engineering, Mechanical Engineering, and by Courtesy, of Materials Engineering at Purdue University. Prior to joining Purdue in 2015, he was a postdoctoral research associate in Department of Materials Science and Engineering at University of Illinois at Urbana-Champaign under the guidance of Prof. John A. Rogers. He received a PhD degree in Mechanical Engineering from Stanford University in 2013. His scholarly efforts are dedicated to addressing unmet clinical needs using novel yet simple wearable devices with a clear path towards translation to produce measurable clinical and economic impacts. These wearable devices, which resemble sticker patches, can be easily integrated with the human body enabling wireless monitoring of health conditions in a non-invasive manner. The potential application of these devices is boundless ranging from artificial skin to drug delivery patch, and to tele-rehabilitation systems. He has published > 55 journal papers with the total citation of > 4,100 and h-index of 31. He has issued two United States patents, and 6 utility (non-provisional) and 10 provisional United States patents, leading him to spin off three startup companies. He has recently received the 2019 NIH Trailblazer Young Investigator Award, 2020 CES Innovator Award, 2020 Purdue Faculty Award of Excellence for Early Career Research, and 2020 Purdue Focus Award.